Kunming Ren, Di Zhuang, Lamei Zhang, Bin Zou, Harbin Institute of Technology, China; Mo Zhou, Heilongjiang Academy of Agricultural Sciences, China

Zhipeng Pang, Yaosen Lv, Likang Zhu, Fengming Hu, Hang Su, Xiaole Ye, Fudan University, China

Bin Xiao, Yue Hu, Harbin Institute of Technology, China

Meilun Zhou, Alina Zare, University of Florida, United States

Zheng Zhou, Zongyong Cui, Bohang Lin, Yijun Li, Zongjie Cao, University of Electronic Science and Technology of China, China

John Gordon Wade, AV, Inc, United States

Haohan Liu, Zhi Sun, Jiangyun Deng, Xiaolong Li, Guolong Cui, University of Electronic Science and Technology of China, China

Sébastien Picard, Yuhei Umeda, Ryuta Tanaka, Shunsuke Ono, Fujitsu, Japan

Yupeng Yu, Shisheng Guo, Zihan Xu, Zhihao Zhu, Yufei Wei, Yisen Zhou, Guolong Cui, University of Electronic Science and Technology of China, China

Zi-Ling Zeng, Shih-Yuan Lin, National Chengchi University, Taiwan; Yu-Ching Lin, National Defense University, Taiwan

James Albano, Rochester Institute of Technology, United States; Ira Ekhaus, BAE Systems Inc., United States; Stanely Rotman, Ben Gurion University of the Negev, United States